Fischer Elektronik 散熱片, BGA, 15.7K/W, 35 x 35 x 10毫米, 黏性箔片, 導電箔片 ICK BGA 35x35x10

Features

• Fischer Elektronik ICK BGA Series Heatsink. ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

Specification

• Quantity：1piece
• For Use With : BGA
• Length : 35mm
• Width : 35mm
• Height : 10mm
• Dimensions : 35 x 35 x 10mm
• Thermal Resistance : 15.7K/W
• Mounting : Adhesive Foil, Conductive Foil
• Colour : Black
• CODE No.:674-4765