Malico 散熱器，球狀網格組件，25 x 25 x 15mm，夾子MBH25001-15W/2.6。 MBH25001-15W/2.6

Feature

• BGA Chipset Heat Sinks. High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance Attachment by plastic clip Excellent performance for both natural convection and low to medium airflow levels with low pressure drop

Specifications

• Quantity:1piece
• For Use With:BGA
• Length:25mm
• Width:25mm
• Height:15mm
• Dimensions:25 x 25 x 15mm
• Mounting:Clip
• Colour:Black
• CODE No.:489-6013