DuPont Toray Specialty Materials K.K. Silpot 184 W/C 1公斤 (含催化劑) SILPOT

Features

• It is the most commonly used silicon resin in microdevice fabrication. Before curing, the resin is a soft gel and can penetrate into gaps as small as 1 μm, making it possible to transfer micro-sized designs.
• After curing, it is transparent and easy to observe. It is also an inexpensive material with excellent durability.

Specification

• Included: 1 kg, with Catalyst (Curing Accelerant)
• Code: NR6711-001

Package size

• 140x265x150mm
• 1.45kg