Sunhayato Corp. SMD DIP 轉換板 (單面, 玻璃環氧樹脂, 54.68 x 25.24 毫米) UB-SMD01

Features

• Substrate for converting surface mount components to 2.54 mm pitch
• A circuit board that converts resistors and capacitors of surface mount components (SMD) to a 2.54 mm pitch for use in breadboards. Supports 1005, 1608 and 2012 chip sizes.

Specification

• Dimensions: 54.68 x 25.24 mm
• Material/Plate Thickness: Single Side Glass Epoxy/0.4 mm
• Finishing Process: Gold Flush
• Pattern: 2.54 mm Pitch, IC Pattern, Land Diameter φ2.0 mm
• Hole Diameter: φ0.9 mm

Package size

• 55x75x35mm