




【商品說明】
具有高熱傳導性及高黏度及低熱阻抗,可以有效取代導熱膏和機械固定的特性,用於填補發熱源與散熱片間的不平整空隙,並將電子產品產生的熱量帶離,達到降溫及散熱的效果。
【商品特色】
【商品應用】
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
【商品規格】
| 物性 | TG-T1000 | 單位 | 公差 | 測試方法 | |||
| 導熱係數 Thermal Conductivity | 1 | 1 | W/mK | ±10% | ASTM D5470 | ||
| 厚度 Thickness | 0.15 | 0.25 | mm | – | ASTM D374 | ||
| 顏色 Color | 白 White | – | – | 目視 Visual | |||
| 補強材 Reinforcement Carrier | 玻纖 Fiberglass mesh | – | – | – | |||
| 工作溫度 Continuous Working Temperature | -30~+120 | °C | – | – | |||
| 短期耐溫 Short time Use Temperature(30sec) | 180 | °C | – | – | |||
| 密度 Density | 1.2 | g/cm3 | – | ASTM D792 | |||
| 初期黏性 Initial Tack | 19 | 11 | cm | – | PSTC-6 | ||
| 保持力 Holding Power 1000g @25°C using 1 in2 | >3000 | min | – | PSTC-7 | |||
| 剝離強度 180° Peeling Strength (aluminim) | >14 | >16 | N/25mm | – | PSTC-101 | ||
| 耐電壓 Dielectric Breakdown Voltage (AC) | ≥3 | ≥6 | KV | - | ASTM D149 | ||
| 熱阻抗 Thermal Impedance @10psi | 0.93 | 1.26 | °C-in2/W | – | ASTM D5470 | ||
| 熱阻抗 Thermal Impedance @30psi | 0.76 | 1.06 | °C-in2/W | – | ASTM D5470 | ||
| 熱阻抗 Thermal Impedance @50psi | 0.61 | 1.05 | °C-in2/W | – | ASTM D5470 | ||
| ●符合RoHS規範 | |||||||
●樣品需求? Need Samples? ●可依需求沖型裁切 Pre-cut for different shapes ●可製成捲料 Roll type is available | |||||||
●建議保存於 25°C以下之環境,並於6個月內使用完畢,以保持膠帶和離型紙具適當的黏合度 T-global guarantees a 6-month shelf life at maximum continuous storage. Storage temperature should under 25℃ to maintain controlled adhesion to the liner. | |||||||
(表格僅供參考,最新規格表請下載Datasheet)
