With a proven track record in research and development, we offer wafers made from high-purity materials in small quantities.
Specifications
Manufacturing method: CZ method
Face orientation: 100
OF position: 110
Resistance: 0.1 to 100 Ω cm
Particles: 0.3 μm, 10 pieces
Size (Inch) × conduction type: 4 × N type
Quantity: 1 box (25 pieces)
* A custom-made product
* The azimuth (Cut Angle), OF position angle tolerance, and thickness tolerance can be machined with smaller and more precise precision, enabling precise groove formation
* Various shapes and surface treatments are possible (Example: Zulling, Holemaking, Wafer with Oxide Film)
* The specific resistivity and the wafer thickness are applicable
Type number: 4 × N type
Please contact us at any time for 8 "or 12".
RoHS3 (EU)2015/863 Certificates can be issued
[About RoHS]